Etch Progression Copper foil does not etch right angles to a board surface. Initially, only the exposed copper surfaces react and are washed away by the etchant, largely dissolving material perpendicular to the board surface. Then, as the etchant progresses from the etch resist layer to the substrate layer, there is increased opportunity for lateral… View ArticleRead More
Keep up with the latest news in PCBs, from innovations in electronics design to helpful tips to help your design fly through the manufacturing floor.
When an engineer orders a printed circuit board from a fabricator, the fabricator will generate a list of steps that assembly line workers must follow to create that board. This list of steps is called a traveler and it follows the project from machine to machine and from assembly line worker to assembly line worker… View ArticleRead More
Good engineers become great engineers when they have a comprehensive understanding of how printed circuit boards are made. This quick tip covers electroplating, via formation, and etching. Fabricators will start with a copper-clad core or stack. They then drill holes in the panel that are larger than the engineer specifies — these holes will become… View ArticleRead More
Back drilling technology reduces reflections in high speed nets. It is the preferred fabrication method in high-speed designs. In this webinar recording, learn the process of back drilling, main advantages, design parameters and more. Download the presentation slides here > Backdrilling_Presentation SlidesRead More