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ATE Boards

Automated Test Equipment (ATE) boards are used in the semiconductor chip testing process. These designs focus on high complexity, high performance, and high layer count.

Type of ATE Hardware

  • Universal Probe cards
  • Device Interface Boards (DIB)
  • Handler Interface Boards (HIB)
  • Probe Interface Boards (PIB)
  • Load Boards
  • Characterization Boards

Advantages

  • 24-Hour Turns
  • Impedance Modeling
  • DFM / DRC Review
  • Technical Support
  • HDI Solutions
  • Assembly Services
  • High Frequency Materials

Capabilities

PCB Thickness.187 mils – .230 mils
Min Impedance Tolerance+/- 7%
Min Finished Thickness Tolerance   +/- 10% (0.254 mm)
Min Dielectric Space1 mil
Drill Pitch0.4 mm
Min Drill Hole4.0
Min Aspect Ratio28:1
Min Drilled Hole to Copper3.5 mil
DUT Pin Count1500
Stub Drill Pitch2.5 mm
Min Internal Line Width2.0 mil
Min Internal Space Cu to Cu2.0 mil
Min External Line Width2.5 mil
Min Extenral Space Cu to Cu2.0 mil
PCB Thickness.0.230 mils
Min Impedance Tolerance+/- 5%
Min Finished Thickness Tolerance   +/- 7 mil (0.1778 mm)
Min Dielectric Space< 1 mil – .05 mil
Drill Pitch0.35 mm
Min Drill Hole4.0
Min Aspect Ratio36:1
Min Drilled Hole to Copper3 mil
DUT Pin Count1500-2000
Stub Drill Pitch2.2 mm
Min Internal Line Width1.75 mil
Min Internal Space Cu to Cu2.0 mil
Min External Line Width2.2 mil
Min Extenral Space Cu to Cu2.0 mil
PCB Thickness> /= 0.250 mils
Min Impedance Tolerance+/- 5%
Min Finished Thickness Tolerance   +/- 7 mil (0.1778 mm)
Min Dielectric Space< .05 mil
Drill Pitch< 0.35 mm
Min Drill Hole3.0
Min Aspect Ratio> 36:1
Min Drilled Hole to Copper2.5 mil
DUT Pin Count> 2000
Stub Drill Pitch2.2 mm
Min Internal Line Width< 1.75 mil
Min Internal Space Cu to Cu1.5 mil
Min External Line Width< 2.2 mil
Min Extenral Space Cu to Cu1.5 mil