Manufacturing

Advanced Engineering

Let our team of process and front-end engineers assist you with your most demanding projects, from impedance calculations and stack-ups to minor changes for increased manufacturability.

Technology Road-Map
Every Day Advanced
4 Mil Line Width / Spacing
IS410 / FR406 / 370HR / FR408		 2-3 Mil Line Width / Spacing
Duroid / Rogers
1-24 Layer PCBs
Entek / HASL / Gold Immersion / Full Body Gold / Silver Immersion / White Tin		 25-38 Layer PCBs
Minimum Thickness: .020 / Maximum Thickness: .150
 Minimum Thickness: .010 / Maximum Thickness: .250


Engineering Capabilities

Panel Size:
18X24

Construction
Balanced
Controlled Dielectric
Controlled Impedance: +/- 5%
Minimum Thickness: .010
Maximum Thickness: .250
Maximum Layer Count: 38
Minimum Line: .002
Minimum Spacing: .002

Laminates& Materials
Di-Functional
Tetra-Functional Tg. 170
Multi-Functional Tg. 170
Minimum Cladding 1/4 oz.
Maximum Cladding 4 oz.
Minimum Core Thickness .002
Maximum Core Thickness .125

Electrical Testing
1 & 2 Sided SMD (Net List)
Dual Access Net List
Flying Probe

Product Type
Multilayer PCB, Backplane, Flex, Rigid Flex,
Surface Mount, Chip on Board
Aluminum and Metal Core
Ball Grid Array, Multi Chip Module

Drilling
Minimum Drill Size = 15 to 1 Aspect Ratio
Minimum Pad Size Over Finished Hole:
Internal .012 / External .008

Solder Mask & Legend Inks
 Per IPC-SM-840
Dry Film
Liquid Photoimagable
Mask Colors: Green, Matte Green, Red, Blue, Black, Yellow, Orange and Clear

Surface Finishes
Entek
HASL
Gold Immersion
Full Body Gold
Gold Flash
White Tin
Silver Immersion

Fabrication
Single / Array Panel
Beveling / Scoring / 6mp Score
Edge Milling / Countersink / Counterbore / Edge
Plating