Panel Size:
18X24
Construction
Balanced
Controlled Dielectric
Controlled Impedance: +/- 5%
Minimum Thickness: .010
Maximum Thickness: .250
Maximum Layer Count: 38
Minimum Line: .002
Minimum Spacing: .002
Laminates& Materials
Di-Functional
Tetra-Functional Tg. 170
Multi-Functional Tg. 170
Minimum Cladding 1/4 oz.
Maximum Cladding 4 oz.
Minimum Core Thickness .002
Maximum Core Thickness .125
Electrical Testing
1 & 2 Sided SMD (Net List)
Dual Access Net
List
Flying Probe
Product Type
Multilayer PCB, Backplane, Flex, Rigid Flex,
Surface Mount, Chip on Board
Aluminum and Metal Core
Ball Grid Array, Multi Chip Module |
Drilling
Minimum Drill Size = 15 to 1 Aspect Ratio
Minimum Pad Size Over Finished Hole:
Internal .012 / External .008
Solder Mask & Legend Inks
Per IPC-SM-840
Dry Film
Liquid Photoimagable
Mask Colors: Green, Matte Green, Red, Blue,
Black, Yellow, Orange and Clear
Surface Finishes
Entek
HASL
Gold Immersion
Full Body Gold
Gold Flash
White Tin
Silver Immersion
Fabrication
Single / Array Panel
Beveling / Scoring / 6mp Score
Edge Milling / Countersink / Counterbore / Edge
Plating
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