Manufacturing

Advanced Engineering

Let our team of process and front-end engineers assist you with your most demanding projects, from impedance calculations and stack-ups to minor changes for increased manufacturability.

Technology Road-Map
Every Day Advanced
5 Mil Line Width / Spacing
IS-410 / FR-404Tg. 145 / FR-406 Tg. 170		 4 Mil Line Width / Spacing
FR-408 / Duroid / Rogers
2-12 Layer PCBs
Entek / HASL / Gold Immersion / Full Body Gold / Silver Immersion / White Tin		 14-20 Layer PCBs
Minimum Thickness: .020 / Maximum Thickness: .150
 Minimum Thickness: .010 / Maximum Thickness: .250


Engineering Capabilities

Panel Size:
18X24

Construction
Balanced
Controlled Dielectric
Controlled Impedance: +/- 5%
Minimum Thickness: .020
Maximum Thickness: .150
Maximum Layer Count: 12
Minimum Line: .004
Minimum Spacing: .004

Laminates& Materials
Di-Functional
Tetra-Functional Tg. 170
Multi-Functional Tg. 170
Minimum Cladding 1/4 oz.
Maximum Cladding 4 oz.
Minimum Core Thickness .005
Maximum Core Thickness .125

Electrical Testing
1 & 2 Sided SMD (Net List)
Dual Access Net List
Flying Probe

Product Type
Multilayer PCB, Backplane
Surface Mount, Chip on Board
Ball Grid Array, Multi Chip Module

Drilling
Minimum Drill Size = 7 to 1 Aspect Ratio
Minimum Pad Size Over Finished Hole:
Internal .015 / External .012

Solder Mask & Legend Inks
 Per IPC-SM-840
Dry Film
Liquid Photoimagable
Mask Colors: Green, Matte Green, Red, Blue, Black, Yellow, Orange and Clear

Surface Finishes
Entek
HASL
Gold Immersion
Full Body Gold
Gold Flash
White Tin
Silver Immersion

Fabrication
Single / Array Panel
Beveling / Scoring / 6mp Score
Edge Milling / Countersink / Counterbore / Edge
Plating